I. Product Overview
Bonding particle inspection is performed through the utilization of differential interference contrast microscopy to stereoscopically display particles.
It calculates and analyzes the types of defects for each category.
Features a high-speed cycle time, reducing labor costs.
II. Specification Parameters
Specification Parameters |
Project | Specification |
Applicable Product Dimensions | 8-inch to 17-inch |
Takt Time | 10s (Cycle Time based on 3 ICs + 3 FPCs) |
Working Pressure | 0.5㎫，200LPM |
Working Voltage | 3P 220V 50㎐ 12㎸A |
Safety | There is a safety lock on the door |
Control Method | PC Control |
Offset Inspection | Alignment Inspection for COG, FOG, and PCB Bonding Areas |
Indentation Inspection | Indentation Particle Diameter of 3μm or More for COG-FOG Inspection |
Foreign Matter Inspection | Detection of Minimum 30μm and Above (Particles, Bubbles, Scratches, Cracks) |
Missed Detection Rate | ≤0.1% |
Over-Inspection Rate | ≤1% |
Remarks | Precision of 3μm for COG and FOG Products, and 50μm for PCB Products |
III. Particle Size, Count, and Distribution
Particle Size refers to the indentation radius caused by a single conductive ball. The Particle Count represents the total number of particles within a single inspection pin frame. Particle Distribution is the ratio between the distribution range of all particles within a single inspection pin frame and the length of the pin frame in the Y direction.
By setting a circle radius, particles with a radius equal to or greater than this set radius can be filtered out. The Particle Count is obtained by calculating the number of yellow circles. The Particle Distribution (ranging from 0 to 1) is derived by calculating the ratio of the length of the yellow area to the length of the green frame.
IV. Detection Principle
The detection utilizes a differential interference microscope to stereoscopically display the conductive balls. The protruding effect is composed of the embossed and engraved portions of the particles, achieving the purpose of bonding inspection. By adjusting the differential interference, the grayscale gradient between light and dark can be increased, significantly enhancing the visibility of the conductive balls.
